C27 Class

Industrial Wi-Fi 7 + Bluetooth 6.0 — engineered for Physical AI

Long-range Bluetooth ranging, Wi-Fi sensing and location, and a dedicated Wi-Fi Aux Radio — converged in a single industrial-grade module on the Qualcomm FastConnect C7700.

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Tri-band 2×2 MIMO with always-on Wi-Fi Aux Radio for ultra-low standby, MLO, 320 MHz, 4K QAM
Proximity & ranging — Wi-Fi Location (802.11az) + Bluetooth Channel Sounding (cm-class)
RF to periphery pads — your antenna, your system, your design antenna freedom
Bluetooth 6.0 2×2 — Tx Beamforming + MRC, BLE Long Range, LE Audio

Build with QUALCOMM®

The C27 deploys the Qualcomm® FastConnect™ C7700 connectivity platform — Wi-Fi 7 + Bluetooth 6.0, tri-band 2×2, with advanced proximity capability, an always-on Wi-Fi Aux Radio, and flexible host integration over PCIe, USB, or SDIO.

One industrial Wi-Fi 7 module. Three converged radio domains.

Long-range Bluetooth ranging · Wi-Fi sensing and location · Wi-Fi Aux Radio.

The AIRETOS C27 brings together three previously-separate radio domains in one industrial Wi-Fi 7 + Bluetooth 6.0 module. For industrial OEMs designing the next generation of physical-AI systems, the redesign target shifts from 'add another radio' to 'do more with one industrial-grade module.' In several deployment classes the C27 competes for the same bill-of-materials budget that previously went to a Wi-Fi module plus a separate sub-GHz long-range or low-power wide-area client radio.

The AIRETOS C27 Class opens a new generation of industrial wireless integration: a complete platform built on the Qualcomm FastConnect C7700, designed for compute, edge AI, robotics, and immersive applications. The C27 delivers tri-band 2×2 MIMO with per-radio PHY peaks of 2.88 Gbps (802.11be, 320 MHz, MCS13), and aggregate throughput beyond that when MLO bonds multiple bands. It pairs that throughput with an always-on Wi-Fi Aux Radio for ultra-low standby scan and RSSI monitoring — and with Wi-Fi Location (802.11az) plus Bluetooth Channel Sounding for centimeter-class proximity and ranging. Wi-Fi Sensing via native Channel State Information (CSI) capture extends the module beyond connectivity into presence and motion awareness. 

The C27 also routes RF signals out to the LGA periphery, leaving antenna topology — chip, PCB-trace, or external — to the system designer who knows the final enclosure best. 

The C27 Class reflects VOXMICRO's continuing commitment to leading wireless connectivity technologies.

Qualcomm ASIC
Powerful Performance
Latest Wireless Standards

Carrier choice
Choose Form-Factor

802.11be Wireless (Wi-Fi 7)

Multi-Link Operation, tri-band

Target Wake Time + Wi-Fi Aux Radio

4K QAM density

Multi-User MIMO

World pre-certified

Long-Range BT Ranging

Built on the Qualcomm FastConnect C7700 silicon foundation that supports Bluetooth 6.0 with Bluetooth Channel Sounding and BLE Long Range (Coded PHY). Channel Sounding enables sub-meter ranging between Bluetooth-enabled devices; BLE Long Range extends connectivity across distances that previously required a dedicated long-range radio. For asset tracking, factory-floor coordination, and equipment localization — one combo module replaces what was a Wi-Fi module plus a dedicated long-range radio.

Sensing and Location

 Supports Wi-Fi Location (IEEE 802.11az) and Channel State Information Capture. The same Wi-Fi 7 radio that moves the data senses the space, locates devices within it, and exposes channel-state information to higher-layer applications — motion detection, presence sensing, gesture recognition, and centimetric ranging when paired with capable infrastructure. The radio that carries the network also becomes a perception layer for the system on top of it.

Dedicated Wi-Fi Aux Radio

Includes a separate Wi-Fi Aux Radio that performs background scanning concurrent with the primary Wi-Fi 7 radios, and listens for inbound traffic while the primary radios are in standby. Improved spectrum awareness and wake-from-sleep responsiveness without compromising the data plane — relevant for battery-driven and duty-cycled industrial endpoints.



LGA Chip-on-Board

MRSP from $ 34.95



C27 Series B, 1216 mm

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  • Faster & easier than chip-down with:
  • Compact footprint
  • QCOM reference land-pattern
  • All RF integrated FEMs
  • Funneled thermal dispersion
  • All I/O, PCIe and UART pinouts
  • Development Board available
  • Soldered, not slotted 
M.2 E-Key

MRSP from $ 39.95



C27 Series R, 2230 mm

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  • All Series B features & certs plus:
  • Carrier to M.2 E-key 3030
  • Standard edge pin mapping
  • All I/O, PCIe and UART to edge
  • All OS drivers plus open source


  •  
Mini-PCI Express

MRSP from $ 39.95



C27 Series H, 2852 mm

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  • All Series B features & certs plus:
  • Carrier to full-size mPCIe
  • Standard edge pin mapping
  • All I/O, PCIe and UART to edge
  • All OS drivers plus open source
  • Full-card, not half mini-card


M.2 B-Key

MRSP from $ 33.95



C27 Series F, 3042 mm

ORDER NOW 

  • All Series B features & certs plus:
  • Carrier to  M.2 B-key 3042
  • Standard edge pin mapping
  • All I/O, PCIe and UART to edge
  • All OS drivers plus open source



Flexible Form Factor

Other than for direct SMT, the C27B Series is available on carriers with edge connectors for standard slot-in form factors: M.2 E-Key (2230), M.2 B+M-Key (3042), and miniPCIe (Half-Mini).

Industrial  temperatures

Designed for operation in Industrial environments spanning −40 °C to +85 °C.


World Certifications


The C27 is being prepared for approvals across the major domains of the USA, Canada, EU, Japan, South Korea, China and more countries.

Designed for Robotics, AGVs & Autonomous Mobile Robots

For mobile platforms that need to roam between access points while running real-time control loops in vibration- and shock-prone environments.

  • Multi-Link Operation architecturally enables lower-disruption roaming by pre-establishing on a secondary link before transitioning the primary
  • Wi-Fi Aux Radio continuously scans for candidate APs without dropping the primary connection — the foundation for fast handover in mobile deployments
  • Pad-out RF eliminates on-module coax mating points — a known fatigue path under continuous vibration
  • Compact 12 × 16 mm LGA frees enclosure volume for sensors, batteries, and compute payloads

Designed for Drones, UAVs & Aerial Platforms

For airborne platforms where every gram matters, antennas are integrated into the airframe, and link continuity over distance is mission-critical.

  • Pad-out RF + integrated antennas removes coax connectors and cables — gram-level weight savings that compound across the airframe
  • MLO across 2.4 / 5 / 6 GHz lets the link adapt to interference and range conditions in flight
  • BLE Long Range (Coded PHY) extends control / telemetry links beyond standard BLE range
  • Industrial −40 °C to +85 °C for high-altitude and exposed-environment operation


Designed for Edge AI Gateways & Inference Appliances

For compact, distributed compute nodes where antenna geometry, host throughput, and presence awareness all matter.

  • Wi-Fi Sensing (CSI capture) turns the wireless link into a presence and motion sensor — no additional hardware
  • Wi-Fi Location (802.11az) + BT Channel Sounding add centimeter-class proximity and ranging for spatial intelligence
  • PCIe Gen 3 host interface for low-latency data return to the inference engine; USB 3 and SDIO 3.0 on roadmap for non-PCIe hosts
  • Pad-out RF supports distributed antenna placement across non-trivial enclosure geometries

All the Wi-Fi 7 advanced features and tools: empower system design with the latest in Wi-Fi 7 power management, Target Wake Time, an always-on Wi-Fi Aux Radio for ultra-low-power scan and RSSI monitoring, Multi-Link Operation across 2.4 / 5 / 6 GHz, support for 320 MHz channel bandwidth on 6 GHz at 11be speeds, low-power PCIe Gen 3 (with L1 sub-state) interface, Wi-Fi Location (802.11az) precision ranging, Wi-Fi Sensing via Channel State Information (CSI) capture, Dynamic Frequency Selection (DFS, radar detection), and more.

  • Complemented by a complete HDK including an Evaluation Board and an LGA CoB socket tool, for access to all PCIe, USB, UART, I²S/SoundWire, I²C, and debug interfaces.
  • Systematically supported with open-source drivers for Linux (mainline kernel and ath driver lineage) and Android, as well as Closed Source Drivers (CLD) for advanced features.
  • Combo Bluetooth 6.0 2×2 on-board: dual-radio architecture with Tx Beamforming + MRC; Bluetooth Channel Sounding for centimeter-class distance measurement; BLE Long Range (Coded PHY); LE Audio (LC3); Isochronous Channels (CIS/BIS) for broadcast and unicast audio; Decision-Based Advertising Filtering.
  • Flexible configuration: chipset variant, CoB + carrier, choice of BT interface bus (USB or UART), antenna and grade.
  • Roadmap: USB 3.0 and SDIO 3.0 host-interface variants in development for designs without PCIe.
  • RF routed to LGA periphery pads

"
"Industrial OEMs designing for physical AI no longer need a Wi-Fi module plus a long-range radio plus a sensing radio plus a ranging tag."

Module-down convenience. Chip-down RF flexibility. 

Going chip-down with a Wi-Fi 7 + BT 6.0 SoC means owning the RF front-end design, the regulatory certification, the manufacturing qualification, and the firmware bring-up. It buys maximum antenna flexibility — at the cost of six to twelve months and a dedicated RF lab.
Going module-down with most pre-certified modules means buying back that time and that overhead — but accepting whatever antenna topology the module vendor chose to bake into the part.




Pick one — get both:

  • Module-down convenience — pre-tested RF, pre-certified for FCC / IC / CE / RoHS, drop-in for production with no in-house RF design
  • Chip-down antenna freedom — RF routed to LGA pads, antenna decision belongs to you (chip, PCB-trace, external dipole, distributed array)
  • Pre-certified antenna paths — selected chip antennas and OXFORDTEC dipoles already covered under the modular approval
  • Custom antenna support — bring your own; we'll work with you to extend the modular approval

    The result: the C27 fits the integrator who wants to ship in six months instead of eighteen and needs the antenna topology their enclosure actually demands.

  1. 1. Block Diagram

  2. 2. Mechanical

  3. 3. Pad Definition

  4. 4. Placement

  5. 5. Part Numbers

  6. 6. Specifications

  7. 7. Documentation

  8. 8. Software

  9. 9. Compliance

  10. 10. Tools & Kits

** showing E20B LGA CoB Block Diagram cconfiguration.

* showing E20B LGA CoB mechanical configuration.


* showing E20B LGA CoB pad configuration. Obtain the full pin-outs for all part numbers from section #7 Documentation.
** Available CAD Models include symbols and footprints for a wide range of design packages, like Altium, OrCAD, Autodesk, PADS, Eagle, etc.

* showing E20B LGA CoB land pattern placement configuration.
** Available CAD Models include symbols and footprints for a wide range of design packages, like Altium, OrCAD, Autodesk, PADS, Eagle, etc.

Identify the C27 Class MPNs with the help of the above legend. 

* The bare C27B module ships with RF routed to LGA pads only — coax connectors are added by the system designer if needed.

Example reference MPNs, with high-availability and low effective lead-time for the C27 Class are:

  • ACB-QCA2066-0WI1 - AIRETOS branded, BT via UART, Industrial temperature grade with MHF1 connectors
  • ACB-QCA2066-5WI1 - AIRETOS branded, BT via USB, Industrial temperature grade with MHF1 connectors
  • AFW-QCA2066-0WI1 - AIRETOS branded, BT via UART, Industrial temperature grade with MHF1 connectors
  • AFW-QCA2066-5WI1 - AIRETOS branded, BT via USB, Industrial temperature grade with MHF1 connectors
  • AEX-QCA2066-0WI1 - AIRETOS branded, BT via UART, Industrial temperature grade with MHF1 connectors
  • AEX-QCA2066-5WI1 - AIRETOS branded, BT via USB, Industrial temperature grade with MHF1 connectors
  • AFF-QCA2066-0WI1 - AIRETOS branded, BT via UART, Industrial temperature grade with MHF1 connectors
  • AFF-QCA2066-5WI1 - AIRETOS branded, BT via USB, Industrial temperature grade with MHF1 connectors

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SOLUTION DESIGN 

Chipset: Qualcomm QCA2066-0 for BT via UART or QCA2066-5 for BT via USB as the main high-availability and low effective lead-time ASIC choices.
• optional use of the respective QCA2065, QCA2064 or QCA2062 chip variants
• the WCN685x family and the QCA6898 IC are also supported
Standard: IEEE 802.11ax Wi-Fi6E plus Bluetooth 5.3 Combo, full backwards compatibility to previous standards
Industrial Reference: Based on Qualcomm Verona reference design; hardware compatible also to Hastings-Prime reference design

APPEARANCE

Communications Interface: 
Pads: LGA-type solder pads or edge connector:
WLAN: via PCI Express Standard 3.0 host I/O 
BT: via UART (with QCA206x-0 SoCs). or via USB 1.1 (with QCA206x-5 SoCs)
BT Audio: via selectable Slimbus/PCM (with QCA206x-0 SoCs), or via I2S (with QCA206x-5 SoCs). I2C in pin-mapped.
Form Factor: 
For E20B: SMD, Chip-on-Board, Soldered, Stamp down, 112 each of Land Grid Array (LGA) type pins, 23.0 x 25.0 mm
Others: Slotted, Socketed [CoB soldered on carrier]

ANTENNA

Configuration: 
WLAN: Two streams (2 chains), 2×2 MIMO, MU-MIMO, with DBS and MLO BT: One stream (1 chain) co-existent with Wi-Fi chain 0 Aux Wi-Fi Radio: dedicated low-power scan / RSSI monitoring on a separate receive core.

RF Routing: RF signals are routed to LGA periphery pads on the C27B module. The carrier board (for slot-in variants) or the system PCB (for direct CoB integration) carries the RF the final distance to the antenna structure.

Antenna Options (pre-certified for C27 modular approval): — Chip antennas for compact, integrated PCB-mount designs and external dipole antennas via coax connectors mounted on the carrier or system board. Custom system antennas can be qualified for additional modular approval on request.

On-carrier connector options: The AFR (M.2 E-Key), AFM (M.2 B+M-Key), and AEH (miniPCIe) carrier variants ship with on-carrier MHF1 coax connectors for plug-and-play compatibility with existing AIRETOS antenna kits. MHF4 option available.

WIRELESS PARAMETERS

Frequency Band: 
WLAN: 
2.4 GHz ISM Bands 2.412-2.472 GHz, 2.484 GHz up to a max of 2.496 GHz
4.9 GHz (optional band support for Japan only)
5.15-5.25 GHz (FCC UNII-low band) for US/Canada, Japan and Europe 
5.25-5.35 GHz (FCC UNII-middle band) for US/Canada and Europe 
5.47-5.725 GHz for Europe
5.725-5.825 GHz (FCC UNII-high band) for US/Canada 
5.850–5.925 GHz (optional band support for U-NII-4 DSRC/ITS)
5.925–6.425 GHz (U-NII-5)      [implemented with QCA2066 and QCA2065 only]
6.425–6.525 GHz (U-NII-6)      [implemented with QCA2066 and QCA2065 only]
6.525–6.875 GHz (U-NII-7)      [implemented with QCA2066 and QCA2065 only]
6.875–7.125GHz (U-NII-8)      [implemented with QCA2066 and QCA2065 only]

BT: 
2402MHz~2480MHz
Data Transfer Rates: 
WLAN: 
802.11ax: Up to 3000Mbps (dynamic)
802.11ac: Up to 867Mbps (dynamic)
802.11n: Up to 300Mbps (dynamic)
802.11a/g: Up to 54Mbps (dynamic)
802.11b: Up to 11Mbps (dynamic)
BT: 
GFSK at 1Mbp
π/4-DQPSK at 2Mpbs
8DPSK at 3Mpbs
Media Access Control: CSMA/CA with ACK
Channel: 
2.4GHz: 1-13 (14 only for Japan)
5GHz: 36-64, 100-165
6GHz: 191-423 (depending on operating domain)
Channel Spacing: 5MHz, 10MHz, 20 MHz, 40Mhz selectable for 2.4Ghz band. 80Mhz and 160MHz also selectable for 5Ghz and 6Ghz spectrums.
Spreading / Modulation: 
WLAN: 
802.11ax: OFDMA (BPSK, adds 1024-QAM on MCS10 and MCS11)
802.11ac/g/n: OFDM (BPSK, DSSS-OFDM, QPSK,16-QAM,64-QAM, 256-QAM), MRC, STBC, LDPC, ML Demodulation
802.11b: CCK (11, 5.5Mbps), DQPSK (2Mbps), BPSK (1Mbps)
BT: 
GFSK, π/4-DQPSK, 8DPSK 
RF Output Power:
WLAN:
802.11b: 18.5 dBm at 11M ±2 dBm
802.11g: 17.5 dBm at 54M ±2 dBm
802.11a: 14.5 dBm at 54M ±2 dBm
802.11n/ax 2.4G V/HT20 17.5 dBm at MCS0 14 dBm at MCS7 ±2dBm 
802.11n/ax 2.4G V/HT40 16.5 dBm at MCS0 14 dBm at MCS7 ±2dBm
802.11ax 2.4G HE20 17.5 dBm at MCS0 11.5 dBm at MCS11 ±2dBm
802.11ax 2.4G HE40 16.5 dBm at MCS0 10 dBm at MCS11 ±2dBm
802.11n/ac/ax 5G V/HT20 16 dBm at MCS0 12 dBm at MCS8 ±2dBm 
802.11n/ac/ax 5G V/HT40 15 dBm at MCS0 11 dBm at MCS9 ±2dBm
802.11ax 5G VHT80 14.5 dBm at MCS0 10 dBm at MCS11 ±2dBm
802.11ax 5G HE80 14.5 dBm at MCS0 9.5 dBm at MCS11 ±2dBm
802.11ax 5G HE160 14 dBm at MCS0 9 dBm at MCS11 ±2dBm
• DBm values reflect single RF chain output power performance. Two chain combined output power can be calculated as the single chain output power plus 3dB (2Tx = 1Tx + 3dB).
BT: 
(Class 2 Mode) +2 dBm ≤ Output Power ≤ +6 dBm
(Class 1 Mode) +2 dBm ≤ Output Power ≤ +10 dBm
RF Receive Sensitivity (Typical, 1x1 chain):
WLAN:
802.11b 11M less than 97.5 dBm 
802.11g 54M less than 92.5 dBm
802.11a 54M less than 92 dBm 
802.11n/ax 2.4G V/HT20 MCS7 less than 72.5 dBm 92.5 dBm at MCS0
802.11n/ax 2.4G V/HT40 MCS7 less than 71.5 dBm 91.5 dBm at MCS0
802.11ax 2.4G HE20 MCS11 less than 63 dBm 92.5 dBm at MCS0
802.11ax 2.4G HE40 MCS11 less than 61 dBm 92 dBm at MCS0
802.11n/ac/ax 5G V/HT20 MCS7 less than 77 dBm 95 dBm at MCS0
802.11n/ac/ax 5G V/HT40 MCS7 less than 74.5 dBm 92.5 dBm at MCS0
802.11ax 5G VHT80 MCS11 less than 60 dBm 88 dBm at MCS0
802.11ax 5G HE80 MCS11 less than 57 dBm 84 dBm at MCS0
802.11ax 5G HE160 MCS11 less than 54 dBm 81 dBm at MCS0
BT: 
BER < 0.1% (Anritsu 8852B Tx -83Bm) 
Operating Range:
Open Space: ~300 m; Indoor: :~100 m
(Coverage vary according to environment, antenna and topography)
Wireless Security:
WEP 64-bit and 128-bit encryption
WPA/WPA2/WPA3 UL/DL (Wi-Fi Protected Access)

MODALITIES

Infrastructure, AP/STA, Client, Bridge, Mixed-mode, P2P/Ad-hoc, Easy Mesh. DBS & NON-DBS (SCC & MCC)

SAFETY & REGULATORY

Compliant with FCC, IC ISED , CE RED and more. 
Compliant with RoHS3.

PROTOCOLS 

IEEE WLAN Network:
IEEE 802.11a/b/g/n/ac/ax (Wi-Fi6E), 
IEEE 802.11d, e, h, i, j, k, r, u, v, w, z, ae 
Other Standards: Bluetooth 5.3 & ANT+ with advanced features: Host to Controller Encryption Key Control Enhancements, LE Power Control, LE Channel Classification Errata, Advertisement Extensions, Channel selection, LE2M, LELR, High Duty Cycle non-connectable advertisements, BT 5.1, ESR11 & ESR12, Minor Functional Enhancements, Advertisement channel, Index, Periodic Advertisement Sync Transfer, Control Length Extension, HID over GATT Profile, SPP Over BR/EDR, A2DP Source, A2DP Sink, AVRCP.
Industry Standards:

HOST SYSTEM REQUIREMENTS 

Operating System: Android/Linux Closed Source, Android/Linux Open Source, Qualcomm Embedded Platform, Windows, MacOS
 * Host supporting PCIe 32 or single MSI interrupts is required for some setups. 
** 50+ MB memory (RAM) is recommended for best performance.

ENVIRONMENTAL 

Operating Temperature: -40 to +85 Celsius (depending on MPN)
Storage Temperature: -45 to +125 Celsius
Operating Humidity: 10% to 90% non-condensing
Storage Humidity: 5% to 90% non-condensing

ELECTRICAL 

Power Consumption: 
PROTOCOL RATE VOLTAGE 2x2 CTx
2.4GHz HE40M            740mA            2.45W
5GHz HE160                   830mA            2.75W
6GHz HE160                 1008mA            3.55W
• Electronic current values in milliampere. Readings retrieved under stable, typical current and voltage.
• Power consumption ratings are statistical maximums in test system setups which are placed in continuous operating modes. 
• Real-life application system power budgets are dependent on traffic mix, environment, topology and domain configuration.

PRODUCT BRIEF

10A-BPM-31 - AIRETOS E20 Class Introduction.pdf

Download

DEVICE SPECIFICATION 

08A-PDDS-131_E20B_Device-Specification.pdf

Download

08A-PDDS-132_E20W_Device-Specification.pdf

Download

08A-PDDS-133_E20X_Device-Specification.pdf

Download

08A-PDDS-134_E20F_Device-Specification.pdf

Download

PAD ASSIGNMENT

AEBPO-190001 - AIRETOS_ACB-QCA206x-xxxx_Pin-Mapping.pdf

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AEBPO-190003 - AIRETOS_AXW-QCA206X-XXX_Pin-Mapping.pdf

Download

AEBPO-190004 - AIRETOS_AXX-QCA206X-XXX_Pin-Mapping.pdf

Download

AEBPO-190002 - AIRETOS_AXF-QCA206X-XXX_Pin-Mapping.pdf

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REFERENCE SCHEMATICS 

Carrier Board Schematics, additionally serving as reference to placement design.

AEBPO-130002 - AIRETOS_AXW-QCA206x-xxxx_M2_E Carrier Board Schematic.pdf

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AEBPO-130003 - AIRETOS_AXX-QCA206x-xxxx_MPCIE Carrier Board Schematic.pdf

Download

AEBPO-130001 - AIRETOS_AXF-QCA206x-xxxx_M2_B Carrier Board Schematic.pdf

Download

MECHANICAL MODELS 

08A-PD3D-98_E20B(UFL)_Device-3D.stp

Download

AEBPO-190012 - AIRETOS ACB-QCA206x-xWx1 Mechanical Drawing.pdf

Download

08A-PD3D-99_E20W(UFL)_Device-3D.stp

Download

AEBPO-190013 - AIRETOS AFW-QCA206x-xWx1 Mechanical Drawing.pdf

Download

08A-PD3D-100_E20X(UFL)_Device-3D.step

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AEBPO-190014 - AIRETOS AEX-QCA206x-xWx1 Mechanical Drawing.pdf

Download

08A-PD3D-101_E20F(UFL)_Device-3D.step

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AEBPO-190015 - AIRETOS AFF-QCA206x-xWx1 Mechanical Drawing.pdf

Download

WINDOWS 

Windows X and later automatically bring up the E20 in the Device manager; see Windows OS specific manual below. Windows Client drivers are also available to download on demand.

09A-CPD24-B1 – AIRETOS E20 Class Manual.pdf

Download

LINUX 

ANDROID 

Qualcomm Embedded Platform Drivers are available to qualified customers.

EMISSIONS 

The E20 Class has been tested and found compliant with FCC, CE RED, and ISED Canada. Contact us if your interest extends to further countries and domains, and to gain access to existing certificates and reports.

The following antennas have been tested and are pre-approved for use with this module class, for operations compliant with regulatory approvals and certification emission limits. The list may vary by domain or country. Contact us to discuss alternative antenna types and configurations.

  • OXFORDTEC WANT-4DBI-SMA [External Omni-directional Antenna], 3.8dBi maximum gain.
  • OXFORDTEC WAPT-4DBI-150 [PCB Dipole Antenna, 15cm cable length], 3.7dBi maximum gain.
  • OXFORDTEC WAFT-4DBI-150 [FPC Dipole Antenna, 15cm cable length], 3.7dBi maximum gain.

AIRETOS_E20_Class_EC-DoC.pdf

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TRADE 

VOXMICRO classifies its products according to the international standards. In that it follows internationally accepted Trade Compliance, Customs, Export Controls and Supply Chain Security practices.

  • US Export Control Classification Number (ECCN): 5A992c
  • Harmonized Tariff (HTS): 8517.62

ENVIRONMENTAL 

VOXMICRO has a proactive, environmentally preferred products program that works across the group. The goal is to offer products that comply with regulatory and customer-defined restrictions. Follow certificates and statements for:

  • EU RoHS & WEEE: EU Restriction of the use of Hazardous Substances (RoHS) Directive.
  • EU's REACH on Registration, Evaluation, Authorization and Restriction of Chemicals has been in force since 2007.
  • USA's TSCA: Toxic Substances Control Act.
  • China RoHS: a series of Management Methods in effect since 2007.

Please contact us for any further clarifications.

VOXMICRO RoHS and WEEE Compliance Declaration.pdf

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05A-SVWE23-3 REACH-SVHC - VOXMICRO Compliance Statement.pdf

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VOXMICRO TSCA Certificate of Compliance.pdf

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VOXMICRO China RoHS Compliance Declaration.pdf

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EVALUATION BOARD 

Develop and test the E20 with the use of an adapter to PCIe 3.0 edge-connector. Contact your account manager to request further information. EVB units (PN# AES-VOXE20FXW) are also available to online orders.


08A-PDDS-135_AES-VOXE20FXW_Device-Specification.pdf

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LGA SOCKET 

Develop and test with E20B LGA Chip-on-Board modules with a special shielded socket, adapted to M.2 B-key edge-connector. Contact your account manager to request information and to access to this engineering tool (PN# AFS-VOXE20B).


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