|AFX-QCA6174-NC||$19.95||M.2 NGFF PCIe 2230 (Series R)||E61R1||-10 to +70°C||2||QCA6174A-5||802.11ac/abgn+BT5.0||21 dbm||MHF4||QCNFA364A|
|AFX-QCA6174-NX||$24.95||M.2 NGFF PCIe 2230 (Series R)||E61R1||-40 to +85°C||2||QCA6174A-5||802.11ac/abgn+BT5.0||21 dbm||MHF4||QCNFA364A|
|AFX-QCA6174-NC-Xkit||$27.95||mPCIe FULL SIZE (Series X)||E61R-Xkit||-10 to +70°C||2||QCA6174A-5||802.11ac/abgn+BT5.0||21 dbm||MHF4||QCNFA364A|
|AFX-QCA6174-NX-Xkit||$32.95||mPCIe FULL SIZE (Series X)||E61R-Xkit||-20 to +75°C||2||QCA6174A-5||802.11ac/abgn+BT5.0||21 dbm||MHF4||QCNFA364A|
Qualcomm-AtherosReference Design: QCNFA364A
- Half Size, minicard format
- Flexible USB 2.0 Interface
- Qualcomm-Atheros QCNFA364A Chipset
- On-board or antenna-out options
- Dual-Band + 2T/2R MIMO
- 802.11ac/abgn – 300Mbps Transfer Rate
Solid orientation to consumer-grade applications, with the option of extended grade, backed by World Regulatory Certification, sort lead-times, high production capacity and energy-saving algorithms programmed in.
Such is its cost-to-features strength, that it provides the natural choice for segments and builds of the Internet-of-Things (IoT) application designs.
- First Released: 2017
- Industry Support: Good
- Production Capacity: 34.000+ pcs/pm
- Retail MSRP / Sample Price: 24.95 USD
We offer a wide variety of customization options that enable customer-specific applications and solutions. Whether you need a custom-made product or complete product development services, we use our extended expertise to bring your product or device to market on-time and efficiently.
Avoid costly revisions and delays, by working with us. Throughout any stage in your development, you can work with our Design Team to receive a comprehensive analysis of your applications and/or devices, which significantly improve their stability and performance, in addition to reducing overall time-to-market, mitigating risk and reducing non-recurring engineering (NRE) costs.
We deliver customer-centric experiences, aided by in-house digital, RF-calibration and regulatory expertise thus adding quality and value to dedicated technology fields.
End-To-End RF Antennas Development
We are a leading manufacturer and supplier of high-quality antennas engineered for superior performance. We provide antenna solutions for Wi-Fi, Bluetooth, and Cellular supporting a wide range of demanding applications.
We offer our AIRETOS® modules together with pre-approved and certified antennas series to significantly improve your application stability and performance, but also to shorten overall time-to-market, mitigate risks and reduce non-recurring engineering (NRE) costs.
In addition to our OxfordTEC® off-the-shelf solutions, we provide end-to-end antenna development support from design to simulation, prototyping, testing and manufacturing for tailor-made antennas to meet your specific application needs.
Embedded antenna tuning in customer devices is crucial for RF performance. We support you to fit and optimize our antennas to your device without affecting their pre-certification status so that you can work efficiently and time-saving.
Performance and Certification Testing
We carry out RF Function & Performance Testing at the modules, antennas and application levels in our facilities in Asia, the United States, and the United Kingdom to provide a complete overview and tuning of our customer device’s radio performance, but also to achieve worldwide certification.
- One-stop-shop testing for wireless modules, customized antennae, and any devices that include wireless technologies
- Worldwide approvals and certification
- Global testing and certification support
We provide high performing solutions with global certification and customer support, whether they are based or our comprehensive modules, antennae, and RF passives off-the-shelf portfolio or are based on customized configurations and specifications.
Dual Band 11AC
The E61 Series F is a single-die wireless local network (WLAN) and Bluetooth (BT) combo solution to support 1×2 IEEE 802.11ac/abgn PCI-E WLAN standards and BT 4.2, enabling the seamless integration of WLAN/BT and low-energy technology. It is a small footprint, low-height, modular design providing a fully-featured cost-effective solution for consumer applications. Connect one or two antennas, as per your design specifications.
The E61 Series F comes with World-level Regulatory Compliance and full compatibility with the latest industry standards and advisory for regulatory adaptability, aiding swift design-to-market deployment solution for the growing consumer electronics applications.
Unlike ordinary wireless networking technologies that are confused by signal reflections, the MIMO implementation in this module actually uses reflections to increase the range and reduce “dead spots” in the wireless coverage area.
The E61 Series F is WiFi Direct® & Miracast® Certified enabling easy direct connectivity and wireless display functionality with other compliant devices without the need of a wireless access point.
A high level of integration and full implementation of power management functions specified in the E61F Series minimizes system power requirements. Both WLAN and BT conserve power having several power-saving modes implemented, like MIMO-PS, UAPSD, Green-Tx, host power offload, Packet-power-save (PHY-NAP), early beacon termination.
Extended Temperature Grade
Operate consumer electronics under extended temperature conditions (-10 ~ 70°C). The E61F Series is a highly integrated wireless, suitable for outdoor and demanding entertainment applications.
Product Market Orientation
“Embedded WiFi with excellent performance.”
Market Orientation Index
TECHPOINT = Baring
LIFESPOT = Agonist
Variants On-Demand = Auxilliary
VERTICALS = 3
Design Cost Orientation = 4
Effective Lead Time = 10 weeks
*Market Orientation Index (MOI): A value calculated from the grading of the factors above. Used as a rule-of-thumb to aid design-in and procurement evaluation. MOI depicts the present product affinity to Innovation (I), Customer Empathy (C) and Price Focus (P).
QC Points per Unit
Units produced per day
Lines of Code at Work
|E61||AIRETOS Datasheet: AFX-QCA6174-NX||E61R, AFX-QCA6174-NX||Data Sheets||1.3||2019/10/22||https://airetos.voxmicro.com/wp-admin/admin-ajax.php?action=wpmf-download-file&id=1y7BVXRNB_ibF2314ATM3orDX9bZ_RHYQ&link=true&dl=1|
|E61||AIRETOS Datasheet: AFX-QCA6174-NC||E61R, AFX-QCA6174-NC||Data Sheets||1.3||2019/10/22||https://airetos.voxmicro.com/wp-admin/admin-ajax.php?action=wpmf-download-file&id=1r9Fi-OZAsTJxX_uN8UsJF-AWksOZL0i7&link=true&dl=1|
|E61||VOXMICRO RoHS2 Compliance Statement: E61R Series||E61R, AFX-QCA6174-NX, E61R, AFX-QCA6174-NC, E61R-Xkit, AFX-QCA6174-NC-Xkit, E61R-Xkit, AFX-QCA6174-NX-Xkit||Statements||https://drive.google.com/open?id=1c9sj5GPJpv-uuuadOsdbfm5pZdNwaCBH|
|E61||AIRETOS Global Regulatory Status: E61 Class||E61R, AFX-QCA6174-NX, E61R, AFX-QCA6174-NC, E61R-Xkit, AFX-QCA6174-NC-Xkit, E61R-Xkit, AFX-QCA6174-NX-Xkit||Approvals||https://drive.google.com/open?id=1NHkOelHwMuFgtPtUzvEy4StF8ykaUpKu|
|E61||AIRETOS Module Image: AFX-QCA6174-NX Front Balancing With Shield||E61R, AFX-QCA6174-NX||PNG||Images||https://drive.google.com/open?id=1mt6BGMy1ftDkGUW1EC4XEe3OZQj0Vzvw|
|E61||AIRETOS Module Image: AFX-QCA6174-NX Duo With Labels||E61R, AFX-QCA6174-NX||PNG||Images||https://drive.google.com/open?id=1m_LWKQRRTacCFWXXDOkoMiDk9RIV-Dy0|
|E61||CHIPSET QCA6174A Qualcomm Product Brief||E61R, AFX-QCA6174-NC, E61R, AFX-QCA6174-NX||Product Briefs||https://airetos.voxmicro.com/wp-admin/admin-ajax.php?action=wpmf-download-file&id=1PYBKoIY90eK8pKPRAEMibkfpTVyYAyql&link=true&dl=1|