Chip-on-Board (CoB): compact, light and flexible

CoB: compact and flexible modules design

Our Chip-on-Board (CoB) modules are wired and bonded directly to a PCB, being compact and lighter. Reduced inductance and capacitance improves their RF operation. They are offered for SMT or are soldered on carriers of various form factors (M.2, miniPCIe) to enable design flexibility by customers.

E63 Class

E98 Class

E61 Class

E95 Class

E94 Class

HA92 Class

Wi-Fi Modules

Bluetooth Modules

Module Form-Factors

Industrial or Consumer

Bus Signalling Layers

VOXMICRO Group

OXFORDTEC ® RF Assemblies

Technical Services

Capabilities

Markets

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